Tag Archive for EOS M 290

Clever entry into the world of industrial 3D printing

EOS, the world’s leading technology supplier in the field of industrial 3D printing of metals and polymers, introduced the material handling solution IPCM M pro for its well-established EOS M 290 system. For this purpose, the EOS M 290 – a highly productive system for the Additive Manufacturing (AM) of metal components – is equipped with a special process chamber door with coupling points to connect with the IPCM M pro and material containers. The combination of system and periphery enables users to convey material easy, fast and safe out of the system, sieve it and refill it into the system – thus, simplifying industrial 3D printing as an established manufacturing method overall.

EOS releases EOSTATE Exposure OT: Optical Tomography (OT) for real-time monitoring of metal-based Additive Manufacturing

EOS, a leading technology provider for industrial 3D printing of metals and polymers, is expanding its EOSTATE monitoring suite to include an additional tool. EOSTATE Exposure OT, the first commercial system for optical tomography worldwide, now provides real-time, camera-based monitoring of the additive, metal-based build process, based on the EOS M 290 system. The solution fully maps each part throughout the build process, layer by layer, regardless of its geometry and size.

EOSPRINT 2.0: Intuitive, open and productive CAM tool for Industrial 3D Printing

EOS, the world’s leading technology provider for industrial 3D printing of metals and polymers, presents EOSPRINT 2.0, the newest version of its comprehensive AM (Additive Manufacturing) CAM environment. Together with data preparation software like Siemens NX™, or Magics, the new EOS software provides an intuitive user interface, offers customers greater freedom for application-specific parameter optimization and allows easier part optimization – leading to increased productivity and part quality. EOSPRINT 2.0 is now available for metal systems EOS M 290 and EOS M 400. Future iterations will include support for all current EOS metal systems and future polymer systems.